SYB-170 Mini Breadboard 170 Tie-Points

The SYB-170 Breadboard 170 Tie-Points is a mini solderless breadboard offering a compact prototyping surface for small circuits, ideal for testing a handful of components without committing to a permanent build. Its interlocking tabs let several boards be joined together for larger layouts.

Key Features:

• Tie Points: Provides 170 solderless tie points in 17 rows of 5-hole strips, with no separate power rail.
• Standard 0.1in Pitch: Holes are spaced on the usual 2.54mm grid, matching DIP ICs, headers and jumper wires.
• Compact Size: Small enough to slip into a project box or sit beside a microcontroller module for quick tests.
• Self-Adhesive Backing: A peel-off adhesive layer on the back allows the board to be fixed to a panel.
• Interlocking Design: Side tabs let it snap together with other SYB-170 or larger breadboards for more space.
• Reusable: Withstands thousands of insert and remove cycles for repeated prototyping.

Package Includes:

• 1 x SYB-170 Mini Breadboard (170 Tie Points)