Breadboard 400 Tie Points (Half-Size Solderless)

The Breadboard 400 Points is a half-size solderless breadboard with two power rails and a central component area, giving hobbyists a compact platform for wiring small circuits without soldering. It is a staple of any electronics bench, from first Arduino experiments to quick sensor tests.

Key Features:

• Tie Points: Offers 400 solderless tie points: 30 rows of 5-hole strips plus two power rails along the top and bottom.
• Standard 0.1in Pitch: Holes are spaced on a standard 2.54mm grid, matching DIP ICs, headers and jumper wires.
• Self-Adhesive Backing: A peel-off adhesive layer on the underside lets the board be mounted to a panel or enclosure.
• Interlocking Design: Side tabs let multiple boards click together to build larger prototyping areas.
• Compact Footprint: Measures roughly 84mm x 55mm, small enough to sit alongside a breadboard-friendly dev board.
• Reusable: Handles thousands of insert/remove cycles, making it suitable for repeated prototyping.

Package Includes:

• 1 x Breadboard (400 Tie Points)