ZY-204 Solderless Breadboard 1660 Tie Point with Binding Post Terminals

The ZY-204 Solderless Breadboard is a 1660 tie-point prototyping board mounted on a sturdy backing plate with three binding post terminals for connecting external power. Its dual power rails and generous tie-point count make it well suited to larger, multi-IC circuit builds.

Key Features:

• Tie Points: 1660 solderless tie points spread across two joined terminal sections.
• Binding Post Terminals: Black, red, and yellow color-coded posts for connecting an external bench power supply.
• Dual Power Rails: Top and bottom bus strips for clean, organized power distribution.
• Standard 2.54mm Pitch: Compatible with DIP ICs, jumper wires, and common 0.1-inch component spacing.
• Rigid Base: Mounted on a sturdy backing plate that keeps the board flat and stable on the bench.

Package Includes:

• 1 x ZY-204 Breadboard