ZY-208 Solderless Breadboard 3220 Tie Points with Metal Base

The ZY-208 Solderless Breadboard is a large-format prototyping board with 3220 tie points and a reinforced metal base plate for extra rigidity. It gives makers and engineers plenty of room to build and test complex circuits without any soldering.

Key Features:

• Tie Points: 3220 total tie points arranged across 40 columns and 63 rows for large circuit layouts.
• Power Rails: 7 power distribution buses running along the edges for organized voltage and ground connections.
• Metal Base: A rigid metal backing plate keeps the board flat and stable during heavy use.
• Standard Spacing: 2.54mm (0.1″) hole pitch, compatible with all standard DIP components and jumper wires.
• Wire Compatibility: Accepts wire gauges from 20 to 29 AWG for secure, low-resistance connections.

Package Includes:

• 1 x ZY-208 Solderless Breadboard (3220 Tie Points)